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MCP1640 SYNCHRONOUS BOOST
CONVERTER EVALUATION BOARD
USER ’S GUIDE
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in this Guide ............................................................................ 6
Recommended Reading........................................................................................ 7
The Microchip Web Site ........................................................................................ 7
Customer Support ................................................................................................. 7
Document Revision History ................................................................................... 8
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 What is the MCP1640 Synchronous Boost Converter Evaluation Board? ..... 9
1.3 What the MCP1640 Synchronous Boost Converter Evaluation Board
Includes .................................................................................................. 10
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Features ....................................................................................................... 12
2.3 Getting Started ............................................................................................. 12
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 15
A.2 Board – Schematic ....................................................................................... 16
A.3 Board – Top Silk and Pads .......................................................................... 17
A.4 Board – Top Copper Layer .......................................................................... 18
A.5 Board – Bottom Copper Layer ..................................................................... 19
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service .................................................................................... 22
? 2010 Microchip Technology Inc.
DS51880A-page 3
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